Role at a glance
- Job function
-
Engineering & R&D Semiconductor & Display Engineering Electrical, Electronics & Controls Engineering
- Salary
- $136K – $184K/yr
- Location
- San Diego, California, United States
- Work arrangement
- On-site
- Employment
- Full-time
- Education
- Bachelor's, Master's
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Qualifications
Required
- Bachelor's degree in Electrical Engineering or a related field
- 5+ years of experience in RF design, preferably in an advanced node
- Proven track record where products have gone to volume production
- Experience with RF communication systems
Preferred
- Master's degree in Electrical or Communications Engineering or a related field
- 7+ years of experience designing full-custom packages/PCBs for high performance chips.
- Strong understanding of RF fundamentals such as s-parameters, impedance matching, and passive components such as couplers and transmission lines.
- Strong understanding of power integrity fundamentals, including selection and optimization of passives in package.
- Experience routing high-speed, high pin count digital and analog interfaces (e.g. SERDES, CPU, memory).
- Understanding of package materials properties related to high-volume production and reliability: temperature cycling, HAST, shock, vibration, thermal resistance, outgassing, etc.
About the role
Original posting provided by amazon
Amazon Leo is an initiative to launch a constellation of Low Earth Orbit satellites that will provide low-latency, high-speed broadband connectivity to unserved and underserved communities around the world.
Come work at Amazon!
The Role
As an IC Packaging Design Engineer, you will engage with an experienced cross-disciplinary staff to conceive and design innovative product solutions. You will work closely with an internal inter-disciplinary team, and third-party suppliers to drive key aspects of product definition, execution and optimization. You must be responsive, flexible and able to succeed within an open collaborative peer environment.
As a member of the packaging team, you will be responsible for package design for mm-wave beamforming SoCs and front-end modules. Strong focus will be on creating the most power optimized solution for a given system performance.
Export Control Requirement
Due to applicable export control laws and regulations, candidates must be a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.
Key job responsibilities
In this role you will:
• Collaborate with digital design, and RF chip designers define floorplans, bump maps, and ball maps for beamforming ICs.
• Work with package vendors on stack-ups, materials selection, package options, and thermal testing/design.
• Analyze cost/performance trade-offs, and complete layout of package types such as FCBGA, FCCSP, WLCSP, QFN, etc.
• Setup and run 3D electromagnetic simulations of package + PCB in tools such as HFSS and Momentum to verify your designs.
• Perform signal integrity checks and create models for packages to identify issues like crosstalk and coupling.
• Assist the thermal team in defining and running thermal simulations of packages and PCBs.
• Collaborate with the Antenna and EE teams to design and layout test and application PCBs for your packages.
• Advise on qualification of packages: HAST, HTOL, board level reliability, etc.
• Define and implement AI-driven workflows for packaging design, leveraging automation and machine learning to accelerate design iterations and optimize performance.
- 5+ years of experience in RF design, preferably in an advanced node
- Proven track record where products have gone to volume production
- Experience with RF communication systems
- 7+ years of experience designing full-custom packages/PCBs for high performance chips.
- Strong understanding of RF fundamentals such as s-parameters, impedance matching, and passive components such as couplers and transmission lines.
- Strong understanding of power integrity fundamentals, including selection and optimization of passives in package.
- Experience routing high-speed, high pin count digital and analog interfaces (e.g. SERDES, CPU, memory).
- Understanding of package materials properties related to high-volume production and reliability: temperature cycling, HAST, shock, vibration, thermal resistance, outgassing, etc.
Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.
Los Angeles County applicants: Job duties for this position include: work safely and cooperatively with other employees, supervisors, and staff; adhere to standards of excellence despite stressful conditions; communicate effectively and respectfully with employees, supervisors, and staff to ensure exceptional customer service; and follow all federal, state, and local laws and Company policies. Criminal history may have a direct, adverse, and negative relationship with some of the material job duties of this position. These include the duties and responsibilities listed above, as well as the abilities to adhere to company policies, exercise sound judgment, effectively manage stress and work safely and respectfully with others, exhibit trustworthiness and professionalism, and safeguard business operations and the Company’s reputation. Pursuant to the Los Angeles County Fair Chance Ordinance, we will consider for employment qualified applicants with arrest and conviction records.
Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.
USA, CA, San Diego - 136,000.00 - 184,000.00 USD annually
Come work at Amazon!
The Role
As an IC Packaging Design Engineer, you will engage with an experienced cross-disciplinary staff to conceive and design innovative product solutions. You will work closely with an internal inter-disciplinary team, and third-party suppliers to drive key aspects of product definition, execution and optimization. You must be responsive, flexible and able to succeed within an open collaborative peer environment.
As a member of the packaging team, you will be responsible for package design for mm-wave beamforming SoCs and front-end modules. Strong focus will be on creating the most power optimized solution for a given system performance.
Export Control Requirement
Due to applicable export control laws and regulations, candidates must be a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.
Key job responsibilities
In this role you will:
• Collaborate with digital design, and RF chip designers define floorplans, bump maps, and ball maps for beamforming ICs.
• Work with package vendors on stack-ups, materials selection, package options, and thermal testing/design.
• Analyze cost/performance trade-offs, and complete layout of package types such as FCBGA, FCCSP, WLCSP, QFN, etc.
• Setup and run 3D electromagnetic simulations of package + PCB in tools such as HFSS and Momentum to verify your designs.
• Perform signal integrity checks and create models for packages to identify issues like crosstalk and coupling.
• Assist the thermal team in defining and running thermal simulations of packages and PCBs.
• Collaborate with the Antenna and EE teams to design and layout test and application PCBs for your packages.
• Advise on qualification of packages: HAST, HTOL, board level reliability, etc.
• Define and implement AI-driven workflows for packaging design, leveraging automation and machine learning to accelerate design iterations and optimize performance.
Basic Qualifications
- Bachelor's degree in Electrical Engineering or a related field- 5+ years of experience in RF design, preferably in an advanced node
- Proven track record where products have gone to volume production
- Experience with RF communication systems
Preferred Qualifications
- Master's degree in Electrical or Communications Engineering or a related field- 7+ years of experience designing full-custom packages/PCBs for high performance chips.
- Strong understanding of RF fundamentals such as s-parameters, impedance matching, and passive components such as couplers and transmission lines.
- Strong understanding of power integrity fundamentals, including selection and optimization of passives in package.
- Experience routing high-speed, high pin count digital and analog interfaces (e.g. SERDES, CPU, memory).
- Understanding of package materials properties related to high-volume production and reliability: temperature cycling, HAST, shock, vibration, thermal resistance, outgassing, etc.
Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.
Los Angeles County applicants: Job duties for this position include: work safely and cooperatively with other employees, supervisors, and staff; adhere to standards of excellence despite stressful conditions; communicate effectively and respectfully with employees, supervisors, and staff to ensure exceptional customer service; and follow all federal, state, and local laws and Company policies. Criminal history may have a direct, adverse, and negative relationship with some of the material job duties of this position. These include the duties and responsibilities listed above, as well as the abilities to adhere to company policies, exercise sound judgment, effectively manage stress and work safely and respectfully with others, exhibit trustworthiness and professionalism, and safeguard business operations and the Company’s reputation. Pursuant to the Los Angeles County Fair Chance Ordinance, we will consider for employment qualified applicants with arrest and conviction records.
Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.
The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits.
USA, CA, San Diego - 136,000.00 - 184,000.00 USD annually
About the company
amazon
Large Enterprise
Amazon is a global leader in e-commerce and cloud computing, founded in 1994 by Jeff Bezos. Initially starting as an online bookstore, it has since expanded its offerings to include a vast range of products and services, including electronics, fashion, and digital content. With Amazon Web Services (AWS), the company also provides powerful cloud solutions to businesses around the world. Known for its innovation, customer-centric approach, and commitment to operational efficiency, Amazon continues to shape the future of retail and technology, consistently seeking new ways to enhance customer experiences.