Role at a glance
- Salary
- $133.8K – $255.2K/yr
- Location
- Phoenix, Arizona, United States
- Work arrangement
- On-site
- Employment
- Full-time
- Experience
- Ph.D. in Optical Engineering, Optics, Photonics, Physics, Applied Physics, Electrical Engineering, Materials Science, Mechanical...
- Education
- Ph.D. in Optical Engineering, Optics, Photonics, Physics, Applied Physics, Electrical Engineering, Materials Science, Mechanical...
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Role Summary
The Packaging Module Development Engineer will develop and integrate laser and optical process technologies for next-generation semiconductor packaging. The role is based at Intel’s pilot line in Chandler, Arizona, and supports technology development and manufacturing readiness.
What You'll Do
- Develop and optimize laser, optical, and advanced packaging processes.
- Design and execute experiments, analyze data, and drive process improvements using scientific and statistical methods.
- Support installation, qualification, and ramp of new equipment and process technologies.
- Investigate process and equipment issues, perform root-cause analysis, and implement solutions to improve yield and reliability.
- Collaborate across engineering teams and document technical findings to support technology development and manufacturing readiness.
Generated from the employer's posting. Verify important details before applying.
View full postingQualifications
Minimum eligibility is a Ph.D. in a listed or related STEM field, a master's degree in those disciplines with 1+ years of relevant experience, or a bachelor's degree in those disciplines with 3+ years of relevant industry experience in laser processing, precision equipment engineering, or semiconductor manufacturing. Relevant experience includes hands-on work with laser, optical, photonic, or related advanced processing technologies; proficiency in programming or scripting tools for data analysis, process development, automation, or equipment control; and experience with experimental methods, statistical analysis, and data-driven problem-solving. Strong analytical, troubleshooting, and communication skills and attention to detail are also listed.
Preferred
- Under the stated “4+ years of” preferred-qualification heading: experience developing laser, optical, or precision micromachining...
- Under the stated “4+ years of” preferred-qualification heading: understanding of laser-material interactions, such as ultrafast pulse...
- Under the stated “4+ years of” preferred-qualification heading: experience with JMP Scripting Language (JSL) or custom scripting for...
- Under the stated “4+ years of” preferred-qualification heading: hands-on operation of 3D optical profilers, confocal microscopes, or...
- Under the stated “4+ years of” preferred-qualification heading: familiarity with optical modeling tools or multi-physics simulation...
Original job description
Content provided by the employer
Original job description
Content provided by the employer
Job Details:
Job Description:
Intel Corporation is one of the world's leading semiconductor companies, driving innovation that shapes the future of computing, connectivity, and intelligence. With a legacy of over 50 years of technological breakthroughs, Intel is committed to creating world-changing technology that improves the lives of every person on the planet. Our culture is built on inclusion, collaboration, and a relentless pursuit of what's next. At Intel, your work matters — and so do you.
Are you passionate about advancing semiconductor packaging technology? Intel's Substrate Packaging Technology Development (SPTD) organization is seeking a Packaging Module Development Engineer specializing in Laser and Optical Processing to join our pilot line in Chandler, Arizona.
In this role, you will develop and integrate next-generation laser and optical process technologies that enable Intel's most advanced packaging solutions. Working with world-class engineers and researchers, you will directly influence the performance, reliability, and manufacturability of future semiconductor products.
Key Responsibilities
- Develop and optimize laser, optical, and advanced packaging processes for next-generation semiconductor technologies.
- Design and execute experiments, analyze data, and drive process improvements using scientific and statistical methods.
- Support the installation, qualification, and ramp of new equipment and process technologies.
- Investigate process and equipment issues, perform root-cause analysis, and implement solutions to improve yield and reliability.
- Collaborate across engineering teams and document technical findings to support technology development and manufacturing readiness.
As a Successful Candidate, You Will Bring:
- A natural collaborator – You thrive in team environments and build strong relationships across functions and disciplines.
- Curious and innovative – You approach challenges with an open mind and a drive to find creative, data-driven solutions.
- Detail-oriented – You take pride in precision and thoroughness in everything from experimental design to documentation.
- An effective communicator – You can translate complex technical findings into clear, actionable insights for diverse audiences.
- Resilient and adaptable – You remain focused and solutions-oriented in a fast-paced, ever-evolving environment.
- A self-starter – You take ownership of your work and proactively identify opportunities for improvement without waiting to be asked.
Qualifications:
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research and relevant previous job and/or internship experience.
Minimum Qualifications:
To be initially considered for this position, candidates must meet one of the following education and experience thresholds:
- Ph.D. in Optical Engineering, Optics, Photonics, Physics, Applied Physics, Electrical Engineering, Materials Science, Mechanical Engineering, or a related STEM field (recent graduates with academic lab/dissertation research in laser processing, optics, or laser-material interaction are strongly encouraged to apply); OR Master's degree in the above STEM disciplines with 1+ years of relevant experience (which may include graduate thesis research, academic lab projects, or industry internships); OR Bachelor's degree in the above STEM disciplines with 3+ years of relevant industry experience in laser processing, precision equipment engineering, or semiconductor manufacturing.
- Relevant experience will be:
- Hands-on experience working with laser, optical, photonic, or related advanced processing technologies in a laboratory, manufacturing, or development environment.
- Proficiency in programming or scripting tools (e.g., Python, MATLAB, JMP/JSL, C++, LabVIEW) for data analysis, process development, automation, or equipment control.
- Experience applying experimental methods (DOE), statistical analysis, and data-driven problem-solving to technical challenges.
- Strong analytical, troubleshooting, and communication skills, with attention to detail and a structured approach to process development.
- Experience applying experimental methods, statistical analysis, and data-driven problem-solving to technical challenges.
Preferred Qualifications:
- 4+ years of:
- Experience developing laser, optical, or precision micromachining processes for semiconductor, microelectronics, advanced materials, or related applications.
- Understanding of laser-material interactions (e.g., ultrafast pulse dynamics, non-linear optical absorption, thermal vs. athermal ablation regimes, or laser-assisted surface finishing).
- Experience with JMP Scripting Language (JSL) or custom scripting for automated reporting, coordinate translation, toolpath generation, or recipe automation.
- Hands-on operation of 3D optical profilers, confocal microscopes, or surface metrology tools to evaluate micro-features, step heights, and surface roughness.
- Familiarity with optical modeling tools or multi-physics simulation software (e.g., COMSOL, ANSYS) for thermal or optical-mechanical modeling.
Job Type:
Experienced HireShift:
Shift 1 (United States of America)Primary Location:
US, Arizona, PhoenixAdditional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust
N/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.About the company
Intel
Large Enterprise
Intel Corporation is a global leader in computing innovation, renowned for its advanced semiconductor manufacturing and technology solutions. Founded in 1968, the company is primarily known for developing microprocessors that power a vast range of computing devices, from personal computers to data centers. With a strong commitment to research and development, Intel continuously drives advancements in artificial intelligence, cloud computing, and the Internet of Things (IoT), aiming to enhance connectivity and computing capabilities around the world. Intel's mission is to create technology that enhances lives and enables progress across various industries.