Role at a glance
- Job function
-
Engineering & R&D Semiconductor & Display Engineering
- Salary
- $115.1K – $162.5K/yr
- Location
- Hillsboro, Oregon, United States
- Work arrangement
- On-site
- Employment
- Full-time
- Experience
- Associate degree with 8 years of work experience, Bachelor degree with 4 years of work experience or Master degree with 2 years of work...
- Education
- Associate degree with 8 years of work experience, Bachelor degree with 4 years of work experience or Master degree with 2 years of work...
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Role Summary
The engineer supports Intel technology development and related engineering activities through focused ion beam (FIB) sample preparation and transmission electron microscopy (TEM) characterization of semiconductor nanostructures. The role supports process and metrology improvement across research and development and manufacturing activities.
What You'll Do
- Prepare FIB lamellae and perform advanced TEM characterization using imaging, electron diffraction, strain analysis, EDS, and EELS.
- Support fabrication, failure analysis, technology development, process development, and process integration activities.
- Collaborate with engineering teams to optimize metrology strategies and troubleshoot process flow issues.
- Perform sample preparation or imaging with advanced FIB and/or TEM tools in support of research and development.
- Contribute to continuous improvement efforts in high-volume manufacturing environments.
Generated from the employer's posting. Verify important details before applying.
View full postingQualifications
Requires one of these combinations: an associate degree with 8 years of work experience, a bachelor degree with 4 years, or a master degree with 2 years. The work experience must involve hands-on FIB sample preparation or TEM prep operation in industry. Requires a strong track record of experience, innovation, and ownership in FIB and TEM.
Preferred
- Strong communication skills to work effectively with peers and customers.
- Ability to work independently and in teams.
- Working knowledge and experience of semiconductor process integration.
Original job description
Content provided by the employer
Original job description
Content provided by the employer
Job Details:
Job Description:
At Intel, we are at the forefront of innovation, creating world-changing technology that enriches the lives of every person on planet. The Foundry labs directly support advancement of Intel's technology development. The transmission electron microscopy group supports engineering activities in fabrication, failure analysis, technology development, process development, process integration, and pathfinding. Our job is to understand where our manufacturing process and metrologies need to be improved. We are looking for engineers who love solving technical problems, are driven to achieve results, and are flexible in adapting to new methods, tools, and fields of study depending on what is needed to solve the problem at hand. The position will involve daily focus ion beam(FIB) lamella preparation and advanced transmission electron microscopy (TEM) characterization on semiconduction nanostructures using TEM imaging, electron diffraction, strain analysis, EDS and EELS. The Time-To-Information-Return (TTIR) of this imaging analysis is critical to TD as we advance process nodes and require revolutionary changes in our support structure and methodologies. We are embarking on those changes. The Engineer will be responsible for but not limited to: o Technical functions in support of engineering activities such as fabrication, failure analysis, technology development, process development, and process integration. o Collaborates with engineering teams to optimize metrology strategies and troubleshoot process flow issues. o Conducts engineering tasks and detailed technical procedures to perform sample preparation or imaging using advanced focused-ion-beam and/or transmission electron microscope tools in support of the research and development activities of Intel. o Contributes to continuous improvement efforts in high volume manufacturing environments. o Performs other related duties as required or as directed. o Continuous upgrading of skill set; requires an open attitude and skills to learn fromQualifications:
Minimum Qualifications:
o Associate degree with 8 years of work experience, Bachelor degree with 4 years of work experience or Master degree with 2 years of work experience. The work experience must be hands-on FIB sample preparation / Transmission Electron Microscopy (TEM) prep operation in industry.
o Strong track record of experience, innovation and ownership in FIB and TEM area.
Preferred qualifications:
o Strong communication skills to work effectively with peer and customers. Be able to work both independently and in teams.
o Working knowledge and experience of semiconductor process integration.
Job Type:
Experienced HireShift:
Shift 2 (United States of America)Primary Location:
US, Oregon, HillsboroAdditional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust
N/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $115,110.00-162,500.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.About the company
Intel
Large Enterprise
Intel Corporation is a global leader in computing innovation, renowned for its advanced semiconductor manufacturing and technology solutions. Founded in 1968, the company is primarily known for developing microprocessors that power a vast range of computing devices, from personal computers to data centers. With a strong commitment to research and development, Intel continuously drives advancements in artificial intelligence, cloud computing, and the Internet of Things (IoT), aiming to enhance connectivity and computing capabilities around the world. Intel's mission is to create technology that enhances lives and enables progress across various industries.