Packaging Substrate Engineer

Summary

Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple’s internal and custom external components of hardware for its consumer electronic products such as iPhone, iPad, Mac, Apple Watch, Apple TV etc. In this highly visible role, you will own and drive sophisticated package selection, new-generation package structure and configuration optimization. You will be responsible for Apple package substrate including design, technology, manufacturing, and reliability, and future roadmap; and work with cross-functional teams to achieve the best package performance.

Description

• Lead SoC package substrate technology development, pathfinding, and roadmap definition.
• Work with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution from concept to HVM.
• Drive industry with sophisticated package solutions, new architecture, material and process development, and spec definitions.
• 5% International travel.

Responsibilities

Work with industry partners to develop new substrate technologies from concept to HVM for Apple packaging roadmap.
Work with cross-functional groups to define & optimize new package substrate architectures based on performance, technical risk, cost, and availability etc.
Problem solving of technical issues during the full product development cycle.

Minimum Qualifications

BS and 10+ years of relevant industry experience.

Preferred Qualifications

MS or Ph.D. and 8+ years of relevant industry experience.
Proven fundamentals in material/chemistry/mechanical engineering field(s).
In-depth knowledge of substrate technology, manufacturing process, design rules, and roadmap.
Hands-on experience in substrate manufacturing and technology development: Cu plating, lithography, dielectric material, via formation, solder resist, surface finish etc.
Familiarity with package assembly and integration process preferred.
Experience in Cadence Allegro platform tools and design review for manufacturing (DFM).
Exceptional technology development & project management skills.
Strong communication & collaborative skills.

Application Deadline

Apple accepts applications to this posting on an ongoing basis.

Pay & Benefits — San Francisco Bay Area, California, United States

At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $184,700 and $324,800, and your base pay will depend on your skills, qualifications, experience, and location.

Apple employees also have the opportunity to become an Apple shareholder through participation in Apple’s discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple’s Employee Stock Purchase Plan. You’ll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses — including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits

Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.