NVIDIA

NVIDIA

Posted via Workday

Senior Package Layout Engineer - Hardware

Posted Aug 7, 2026

Role at a glance

Salary
$136K – $258.8K/yr
Location
Santa Clara, California, United States
Work arrangement
Hybrid
Employment
Full-time
Experience
5+ years experience in PCB Layout
Education
B.S. Electrical Engineering or equivalent experience

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Role Summary

AI-generated

The Senior Package Layout Engineer will join NVIDIA's Layout team to design and develop detailed IC substrate layouts for NVIDIA products. The role collaborates with the Technical Package Lead and design teams on sophisticated ASIC packages, addressing layout, manufacturing, cost, and electrical design considerations.

What You'll Do

  • Collaborate to implement high speed/density ASIC packages.
  • Perform substrate breakout patterns for ASIC packages.
  • Optimize package pinout incorporating system level trade-offs of pins assignment.
  • Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite.
  • Conduct design feasibility studies to evaluate package design goals for size, cost, and system performance.
  • Develop symbols and CAD library databases using Cadence APD design tools.

Generated from the employer's posting. Verify important details before applying.

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Qualifications

B.S. Electrical Engineering or equivalent experience; 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology; significant background with Cadence APD or SiP and/or PCB layout tools, including Constraint Manager; solid understanding of high-speed design signal integrity practices.

Required

  • B.S. Electrical Engineering or equivalent experience
  • 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology
  • Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager)
  • Solid understanding of high-speed design signal integrity practices

Preferred

  • Experience with HDI designs
  • Proven experience in substrate layout of wire bond and flip chip packages
  • Experience with Virtuoso and Calibre
  • Experience using Valor

Original job description

Content provided by the employer

NVIDIA's GPUs and SOCs are the world leaders in power, performance and efficiency. We are continually innovating to deliver new and creative, unusual solutions to extraordinary problems in a wide range of sectors. To this purpose, we are now seeking a hard-working Senior Package Layout Engineer who is committed to making a difference in the world through their contributions!

This position will collaborate with Technical Package Lead and different design teams in the design and development of sophisticated, detailed layout of IC substrates for NVIDIA products. In addition, work with design teams to plan schedules, resolve costs, manufacturing, and electrical design issues.


What you'll be doing:

  • As part of a Layout team, you will collaborate to implement high speed/density ASIC packages.

  • Perform substrate breakout patterns for ASIC packages.

  • Optimize package pinout incorporating system level trade-offs of pins assignment.

  • Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite.

  • Propose layout design trade-offs to the Technical Package Lead for resolution and implementation.

  • Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance.

  • Develop symbols and CAD library databases using Cadence APD design tools

  • Develop methodologies to improve layout productivity


What we need to see:

  • Hold a B.S. Electrical Engineering or equivalent experience

  • 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology. Experience with HDI designs is a plus

  • Proven experience in substrate layout of wire bond and flip chip packages, preferred

  • Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager)

  • Solid understanding of high-speed design signal integrity practices

  • Experience with Virtuoso and Calibre is a plus

  • Experience using Valor is helpful
     

NVIDIA is widely considered to be one of the technology world’s most desirable employers! We have some of the most forward-thinking and dedicated people in the world working for us. If you're creative and autonomous, we want to hear from you.

#LI-Hybrid

Your base salary will be determined based on your location, experience, and the pay of employees in similar positions. The base salary range is 136,000 USD - 212,750 USD for Level 3, and 168,000 USD - 258,750 USD for Level 4.

You will also be eligible for equity and benefits.

Applications for this job will be accepted at least until August 10, 2026.

This posting is for an existing vacancy. 

NVIDIA uses AI tools in its recruiting processes.

NVIDIA is committed to fostering an inclusive work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.

NVIDIA

About the company

NVIDIA

Large Enterprise

NVIDIA is a leading technology company renowned for its graphics processing units (GPUs) and innovative computing solutions that enhance visual experiences across multiple platforms, including gaming, scientific research, and artificial intelligence. Founded in 1993, the company has expanded its offerings to include powerful AI frameworks and deep learning platforms, making significant contributions to industries such as gaming, data centers, automotive, and healthcare. NVIDIA's commitment to pushing the boundaries of visual computing continues to drive advancements in both hardware and software, positioning the company at the forefront of emerging technologies and digital transformation.