NVIDIA

NVIDIA

Posted via Workday

Senior Physical Failure Analysis Engineer

Posted Aug 5, 2026

Role at a glance

Salary
$144K – $230K/yr
Location
Santa Clara, California, United States
Work arrangement
On-site
Employment
Full-time
Experience
at least 8 years of relevant, hands-on experience.
Education
A B.S., M.S., or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry, or a closely related field (or equivalent...

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Role Summary

AI-generated

The Failure Analysis Engineer will join NVIDIA’s Physical Failure Analysis team and work in its Failure Analysis Lab on advanced integrated circuits, deep learning processors, system architectures, and complex packaging technologies. The role investigates product failures, determines root causes, and provides physical characterization data to support product yield, performance, reliability, design, process, and customer failure-analysis efforts.

What You'll Do

  • Design and implement failure-analysis methodologies for leading-edge silicon, advanced heterogeneous packaging technologies, and complex...
  • Perform mechanical cross-sectioning, parallel de-layering, and chemical/plasma de-processing of IC devices across die, package,...
  • Apply Focused Ion Beam sample preparation and analysis techniques for electrical and physical diagnostics of IC chips.
  • Develop characterization techniques and specialized analysis platforms for emerging chip structures and complex packaging schemes.
  • Design and implement failure-analysis workflows to improve laboratory efficiency and reproducibility.
  • Lead failure-analysis investigations and deliver physical characterization data for engineering evaluations and customer...

Generated from the employer's posting. Verify important details before applying.

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Qualifications

Deep understanding of semiconductor IC fabrication, advanced packaging/assembly processes, and advanced failure analysis methodologies; proficiency in IC device sample preparation; hands-on expertise with Optical and Electron microscopy (SEM/TEM); and working knowledge of physical and electrical failure analysis across die, package, component, and board levels.

Required

  • Deep understanding of semiconductor IC fabrication, advanced packaging/assembly processes, and advanced failure analysis methodologies
  • Proven proficiency in precision IC device sample preparation for targeted defect localization and physical root-cause analysis
  • Hands-on expertise with advanced Optical and Electron microscopy (SEM/TEM), alongside related analytical inspection techniques
  • Strong working knowledge of physical and electrical failure analysis across die, package, component, and board levels
  • B.S., M.S., or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry, or a closely related field (or equivalent experience)
  • At least 8 years of relevant, hands-on experience

Original job description

Content provided by the employer

NVIDIA is the pioneer of GPU-accelerated computing and the engine powering the global AI revolution. We build the full-stack AI infrastructure, advanced microelectronics, and hardware ecosystems that drive everything from massive data center AI factories to autonomous vehicles, robotics, and advanced scientific simulation. Physical Failure Analysis team is relentlessly committed to quality, pushing the boundaries of semiconductor innovation and hardware reliability. 

We are seeking a highly skilled and motivated Failure Analysis Engineer to join our world-class Failure Analysis Lab. In this role, you won’t just solve problems—you will work at the dynamic intersection of physics, process technology, physical design, and circuit design to investigate complex product failures and drive critical engineering solutions. The Mission: Perform Physical Failure Analysis (PFA) on some of the world’s most advanced integrated circuits, deep learning processors, and system architectures, uncovering root causes that directly shape the future of computing. We are looking for an adaptable technical expert capable of translating open-ended challenges into actionable insights. If you excel in fast-paced environments and want to help build the infrastructure defining the modern era, we encourage you to apply.

 

What You’ll Be Doing:

Develop Advanced FA Techniques & Methodologies

  • Pioneer Novel Methods: Design and implement cutting-edge methodologies to drive successful root-cause investigations on leading-edge silicon, advanced heterogeneous packaging technologies, and complex integrated systems.

  • Precision De-processing: Perform mechanical cross-sectioning, parallel de-layering, and advanced chemical/plasma de-processing of integrated circuit (IC) devices across die, package, component, and board levels.

  • Nanoscale Analysis: Apply advanced Focused Ion Beam (FIB) sample preparation and analysis techniques to enable high-resolution electrical and physical diagnostics of IC chips.

  • Innovate Characterization Platforms: Develop novel characterization techniques and specialized analysis platforms tailored for emerging chip structures with advanced silicon architectures and complex packaging schemes.

  • Optimize Workflows: Design and implement robust failure analysis (FA) workflows to improve laboratory efficiency and guarantee accurate, reproducible root-cause determination.

Conduct In-Depth FA Investigations

  • Lead Root-Cause Investigations: Head high-impact failure analysis investigations to isolate the root causes of critical failures affecting product yield, performance, and long-term reliability.

  • Support multi-functional Engineering: Deliver precise physical characterization data to support engineering teams with Design of Experiments (DOE) evaluations, design optimization, process node improvements, and critical customer FA requests.

What We Need to See:

  • Domain Expertise: Deep understanding of semiconductor IC fabrication, advanced packaging/assembly processes, and advanced failure analysis methodologies.

  • Sample Preparation: Proven proficiency in precision IC device sample preparation for targeted defect localization and physical root-cause analysis.

  • Microscopy & Inspection: Hands-on expertise with advanced Optical and Electron microscopy (SEM/TEM), alongside related analytical inspection techniques.

  • System-Level Analysis: Strong working knowledge of physical and electrical failure analysis across die, package, component, and board levels.

  • Education & Experience: A B.S., M.S., or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry, or a closely related field (or equivalent experience), paired with at least 8 years of relevant, hands-on experience.

With competitive salaries and a generous benefits package, NVIDIA is widely considered to be one of the technology world’s most desirable employers. We have some of the most hard-working and dedicated people in the world working for us and, due to unprecedented growth, our best-in-class engineering teams are rapidly growing. If you're a creative and autonomous engineer with a real passion for technology, we want to hear from you. 

Your base salary will be determined based on your location, experience, and the pay of employees in similar positions. The base salary range is 144,000 USD - 230,000 USD.

You will also be eligible for equity and benefits.

Applications for this job will be accepted at least until July 13, 2026.

This posting is for an existing vacancy. 

NVIDIA uses AI tools in its recruiting processes.

NVIDIA is committed to fostering an inclusive work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.

NVIDIA

About the company

NVIDIA

Large Enterprise

NVIDIA is a leading technology company renowned for its graphics processing units (GPUs) and innovative computing solutions that enhance visual experiences across multiple platforms, including gaming, scientific research, and artificial intelligence. Founded in 1993, the company has expanded its offerings to include powerful AI frameworks and deep learning platforms, making significant contributions to industries such as gaming, data centers, automotive, and healthcare. NVIDIA's commitment to pushing the boundaries of visual computing continues to drive advancements in both hardware and software, positioning the company at the forefront of emerging technologies and digital transformation.