SK hynix is running the 2026 Summer Global Internship Program (June–August) for undergraduate, master’s, and Ph.D. students. Eligible applicants include international students currently enrolled at universities in Korea or abroad, as well as Korean students studying overseas (limited to R&D positions).

1) Eligibility and Application Method

Eligibility: Candidates for the 2026 Summer Global Internship (June to August)

- International students enrolled in universities in Korea or abroad
- Korean students studying overseas (limited to R&D positions)

Application: Submit your application through the official recruitment site www.skcareers.com (or QR code).

2) Selection Process

Application Review: Comprehensive review based on resume/CV regarding major, research, and competencies.

Short Online Interview: A brief online interview focusing on personality and suitability (schedule to be agreed upon).

Offer Letter & Visa: Issuance of an offer letter (including conditions, salary, and benefits) + Visa sponsorship for international applicants.

Internship: Starts in mid-June, spans 8 weeks (some scheduling changes may occur).

Performance Evaluation: Consideration for regular employment based on organizational needs.

3) Important Notes for International Applicants

Positions marked “Non-Korean” are exclusive to international applicants.

Work Location: Specified next to the job title (Icheon/Bundang/Seoul).

Some positions may require a TOPIK level of 3 or higher.

Applicants must not have any disqualifications for employment in Korea.

4) Key Recruitment Positions (Summary)

R&D/Engineering (Graduate-focused)

- System Analysis (Icheon): Analyzing GPU memory requirements based on AI workloads, evaluating PIM/PNM performance and power, researching custom HBM/next-generation architectures.
- Interface Design (Icheon): Designing high-speed interface IP for NAND high-speed I/O/SerDes, Rx/Tx/DCC.
- SSD Architecture (Bundang): Applying AI in SSD architecture, building a Q&A/knowledge database based on RAG, developing design automation agents.
- Solution Architecture (Bundang): Designing next-generation computing architectures based on RISC-V/ARM DSA, memory/storage/network.
- Pathfinding Research (Icheon): Exploring future memory device technologies, researching PPA improvements from a system perspective through simulation/modeling.
- Plasma Engineering (Icheon): Solving patterning problems based on etching/photo, plasma analysis, and developing new gases/sources.
- Advanced Process Engineering (Icheon): Researching next-generation DRAM/NAND processes, materials, and devices (2D/III-V, OSC, MRAM, etc.).
- Advanced PKG Engineering (Icheon): Developing advanced packaging processes, materials, and reliability for FOWLP/2.5D/3D-IC.
- ESG Planning (Icheon): Managing ESG strategy/risk, benchmarking, and execution monitoring (English research + Korean documents).

Non-Korean (Exclusive to international applicants) — Mixed Undergraduate/Graduate

- IR Communication (Bundang): Performance announcements/IR events, market/industry analysis, preparing IR materials (some positions require TOPIK level 3 or higher).
- Asset Accounting (Icheon): Managing fixed assets/accounting/auditing responses (some positions require TOPIK level 3 or higher).
- Procurement (Icheon): Analyzing global supply chains/equipment vendors, responding to risks, negotiations/communications (some positions require TOPIK level 4 or higher).
- Global Legal Affairs (Bundang): Conducting research on international transactions/regulations, reviewing contracts/dispute support (English required, Korean preferred).
- Patent Licensing (Bundang): Responding to patent disputes/contracts/trend analysis (engineering/law preferred, JD preferred).
- Growth & Development: Operating employee AI/global competency training programs (language proficiency preferred).